ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,392,546, issued on Aug. 19, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Refrigerator and method for controlling same... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,354, issued on Aug. 19, was assigned to Sharp K.K. (Sakai, Japan). "Display device and method for controlling display device" was invented ... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,390,834, issued on Aug. 19, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan). "Piezoelectric device and acoustic transducer" was in... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,395,522, issued on Aug. 19, was assigned to RELIAQUEST HOLDINGS LLC (Tampa, Fla.). "Threat mitigation system and method" was invented by Brian ... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,391,217, issued on Aug. 19, was assigned to TOYOTA JIDOSHA K.K. (Toyota, Japan). "Vehicle" was invented by Yuzuru Shiota (Nagoya, Japan). Acco... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,392,448, issued on Aug. 19, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Electronic device comprising transparent dis... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,396,256, issued on Aug. 19, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Semiconductor device including tran... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. D1,089,487, issued on Aug. 19, was assigned to Pluto Prospects Inc. (Colorado Springs, Colo.). "Dribble crossover device" was invented by William ... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,390,877, issued on Aug. 19, was assigned to Tianjin Sunke Digital Control Technology Co. Ltd (Tianjin, China). "Method, device, apparatus and s... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,390,879, issued on Aug. 19, was assigned to WITS Co. LTD. (Gyeonggi-Do, South Korea). "Dual type ultrasonic bonding apparatus and bonding metho... Read More